Flip-chip package integrating optical and electric

专利名称：Flip-chip package integrating optical and

electrical devices and coupling to awaveguide on a board

发明人：Kishore K. Chakravorty,Johanna

Swan,Brandon C. Barnett,Joseph F.Ahadian,Thomas P. Thomas,Ian Young

申请号：US10158250申请日：20020530公开号：US06754407B2公开日：20040622

专利附图：

摘要：A package allowing both electrical and optical coupling between one or moreintegrated circuits and a printed circuit board (PCB) has an optical waveguide structures inaddition to electrical connections. An optically active device is flip-chip bonded directly toan integrated circuit using solder bump technology. The optically active device has a lensattached to it to facilitate optical coupling to the optical waveguide. The integratedcircuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bondedto the PCB using solder reflow technology.

申请人：INTEL CORPORATION

代理机构：Pillsbury Winthrop LLP

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