Semiconductor power module with connection pins

专利名称：Semiconductor power module with

connection pins

发明人：MILLER, GERHARD, DR. ING.,FELDVOSS,

MARIO, DIPL.- ING.

申请号：EP96108534.7申请日：19960529公开号：EP0750344A3公开日：19990421

专利附图：

摘要：The semiconductor module has a housing with a housing wall (2) and a base (1)supporting a number of semiconductor elements (5). The housing wall has externally

projecting terminal pins (9) provided by the upper part of a connection lead (7) which iscoupled to the semiconductor element on the inside of the housing. The part of theconnection lead on the inside of the housing has a rectangular cross-section, with agreater cross-sectional surface than the sum of the cross- sections of the terminal pins.

申请人：SIEMENS AKTIENGESELLSCHAFT

地址：Wittelsbacherplatz 2 80333 München DE

国籍：DE

更多信息请下载全文后查看