CD74FCT244M96G4,CD74FCT244ATMG4,CD74FCT244MG4,CD74FCT244SM96G4, 规格书,Datasheet 资料

 CD74FCT244, CD74FCT244ATBiCMOS OCTAL BUFFERS/LINE DRIVERSWITH 3-STATE OUTPUTSSCBS722B – JULY 2000 – REVISED AUGUST 2003DBiCMOS Technology With Low QuiescentDDDDDDDPowerBuffered InputsNoninverted OutputsInput/Output Isolation From VCCControlled Output Edge Rates64-mA Output Sink CurrentOutput Voltage Swing Limited to 3.7 VSCR Latch-Up-Resistant BiCMOS Processand Circuit DesignCD74FCT244...E, M, OR SM PACKAGECD74FCT244AT...E OR M PACKAGE(TOP VIEW)description/ordering information1OE1A12Y41A22Y31A32Y21A42Y1GND1234567891020191817161514131211VCC2OE1Y12A41Y22A31Y32A21Y42A1The CD74FCT244 and CD74FCT244AT are octalbuffer/line drivers with 3-state outputs using asmall-geometry BiCMOS technology. The output stages are a combination of bipolar and CMOS transistors thatlimit the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V)reduces the power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce andground bounce and their effects during simultaneous output switching. The output configuration also enhancesswitching speed and is capable of sinking 64 mA.These devices are organized as two 4-bit buffers/line drivers with separate active-low output-enable (OE)inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputsare in the high-impedance state.To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.ORDERING INFORMATIONTAPACKAGE†PDIP – ESOIC – M0°C to 70°CSSOP – SMPDIP – ESOIC – MTubeTubeTape and reelTape and reelTubeTubeTape and reelORDERABLEPART NUMBERCD74FCT244ECD74FCT244MCD74FCT244M96CD74FCT244SM96CD74FCT244ATECD74FCT244ATMCD74FCT244ATM96TOP-SIDEMARKINGCD74FCT244E74FCT244MFCT244SMCD74FCT244ATE74FCT244ATM†Package drawings, standard packing quantities, thermal data, symbolization, and PCB designguidelines are available at www.ti.com/sc/package.FUNCTION TABLE(each buffer/driver)INPUTSOELLHAHLXOUTPUTYHLZPlease be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.Copyright  2003, Texas Instruments IncorporatedPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•1芯天下--http://oneic.com/SCBS722B – JULY 2000 – REVISED AUGUST 2003CD74FCT244, CD74FCT244ATBiCMOS OCTAL BUFFERS/LINE DRIVERSWITH 3-STATE OUTPUTSlogic diagram (positive logic)1OE12OE19 1A12181Y12A11192Y11A24161Y22A21372Y21A36141Y32A31552Y31A48121Y42A41732Y4absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†DC supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 VDC input clamp current, IIK (VI < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mADC output clamp current, IOK (VO < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mADC output sink current per output pin, IOL 70 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . mADC output source current per output pin, IOH –30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . mAContinuous current through VCC, ICC 140 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . mAContinuous current through GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 mAPackage thermal impedance, θJA (see Note 1):E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/WM package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/WSM package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C to 150°CStorage temperature range, Tstg –65†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES:1.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditions (see Note 2)MINVCCVIHVILVIVOIOHIOL∆t/∆vSupply voltageHigh-level input voltageLow-level input voltageInput voltageOutput voltageHigh-level output currentLow-level output currentInput transition rise or fall rate (slew rate)004.7520.8VCCVCC–156410MAX5.25UNITVVVVVmAmAns/VTAOperating free-air temperature070°CNOTE 2:All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.2POST OFFICE BOX 655303 DALLAS, TEXAS 75265•芯天下--http://oneic.com/ CD74FCT244, CD74FCT244ATBiCMOS OCTAL BUFFERS/LINE DRIVERSWITH 3-STATE OUTPUTSSCBS722B – JULY 2000 – REVISED AUGUST 2003electrical characteristics over recommended operating free-air temperature range (unlessotherwise noted)PARAMETERVIKVOHVOLIIIOZIOS†ICC∆ICC‡CiCoII = –18 mAIOH = –15 mAIOL = 64 mAVI = VCC or GNDVO = VCC or GNDVI = VCC or GND,VI = VCC or GND,One input at 3.4 V,VI = VCC or GNDVO = VCC or GNDVO = 0IO = 0Other inputs at VCC or GNDTEST CONDITIONSVCC4.75 V4.75 V4.75 V5.25 V5.25 V5.25 V5.25 V5.25 V–6081.610152.40.55±0.1±0.5–60801.61015TA = 25°CMINMAX–1.22.40.55±1±10MINMAX–1.2UNITVVVmAmAmAmAmApFpF†Not more than one output should be tested at a time, and the duration of the test should not exceed 100 ms.‡This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.switching characteristics over recommended operating free-air temperature range,VCC = 5 V ± 0.25 V (unless otherwise noted) (see Figure 1)CD74FCT244PARAMETERtpdtentdisFROM(INPUT)AOEOETO(OUTPUT)YYYTA = 25°CTYP4.565MIN1.51.51.5MAX6.587CD74FCT244ATTA = 25°CTYP3.84.84.5MIN1.51.51.5MAX5.36.55.8UNITnsnsnsnoise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°CPARAMETERVOL(P)VOH(V)VIH(D)VIL(D)Quiet output, maximum dynamic VOLQuiet output, minimum dynamic VOHHigh-level dynamic input voltageLow-level dynamic input voltage20.8MINTYP10.5MAXUNITVVVVoperating characteristics, VCC = 5 V, TA = 25°CPARAMETERCpdPower dissipation capacitanceTEST CONDITIONSNo load,f = 1 MHzTYP35UNITpFPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•3芯天下--http://oneic.com/SCBS722B – JULY 2000 – REVISED AUGUST 2003CD74FCT244, CD74FCT244ATBiCMOS OCTAL BUFFERS/LINE DRIVERSWITH 3-STATE OUTPUTSPARAMETER MEASUREMENT INFORMATION7 VFrom OutputUnder TestCL = 50 pF(see Note A)TestPoint500 ΩFrom OutputUnder TestCL = 50 pF(see Note A)500 ΩS1OpenGND500 ΩTESTtPLH/tPHLtPLZ/tPZLtPHZ/tPZHOpen DrainS1Open7 VOpen7 V LOAD CIRCUIT FORTOTEM-POLE OUTPUTSLOAD CIRCUIT FOR3-STATE AND OPEN-DRAIN OUTPUTS1.5 V10%90%tr90%3 V1.5 V10%0 Vtf3 VTiming Input1.5 V0 V3 VtsuData Input0 V1.5 Vth3 V1.5 V0 VVOLTAGE WAVEFORMSSETUP AND HOLD TIMES3 VOutputControltPZLVOHOutputWaveform 1(see Note B)tPZHVOHOutputWaveform 2(see Note B)1.5 V1.5 V3 V1.5 V1.5 V0 VtPLZ≈3.5 VVOL + 0.3 VVOLtPHZVVOH – 0.3 VOH≈0 VVOLTAGE WAVEFORMSENABLE AND DISABLE TIMESLOW- AND HIGH-LEVEL ENABLINGVOLTAGE WAVEFORMINPUT RISE AND FALL TIMEStwInput1.5 V1.5 VVOLTAGE WAVEFORMSPULSE DURATIONInputtPLHIn-PhaseOutputtPHLOut-of-PhaseOutput1.5 V1.5 V0 VtPHL1.5 V1.5 VVOLtPLH1.5 V1.5 VVOLVOLTAGE WAVEFORMSPROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSNOTES:A.CL includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr and tf = 2.5 ns.D.The outputs are measured one at a time with one input transition per measurement.E.tPLZ and tPHZ are the same as tdis.F.tPZL and tPZH are the same as ten.G.tPHL and tPLH are the same as tpd.Figure 1. Load Circuit and Voltage Waveforms4POST OFFICE BOX 655303 DALLAS, TEXAS 75265•芯天下--http://oneic.com/PACKAGE OPTION ADDENDUM

www.ti.com

28-Aug-2010

PACKAGING INFORMATION

Orderable DeviceCD74FCT244ATECD74FCT244ATEE4CD74FCT244ATMCD74FCT244ATM96CD74FCT244ATM96E4CD74FCT244ATM96G4CD74FCT244ATME4CD74FCT244ATMG4CD74FCT244ECD74FCT244EE4CD74FCT244MCD74FCT244M96CD74FCT244M96E4CD74FCT244M96G4CD74FCT244ME4CD74FCT244MG4

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Status

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Package TypePackage

Drawing

PDIPPDIPSOICSOICSOICSOICSOICSOICPDIPPDIPSOICSOICSOICSOICSOICSOIC

NNDWDWDWDWDWDWNNDWDWDWDWDWDW

Pins20202020202020202020202020202020

Package Qty

20202520002000200025252020252000200020002525

Eco Plan

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Lead/Ball Finish

MSL Peak Temp

(3)

Samples(Requires Login)Purchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesPurchase SamplesContact TI Distributoror Sales OfficePurchase SamplesPurchase SamplesPurchase SamplesContact TI Distributoror Sales OfficeContact TI Distributoror Sales Office

ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE

Pb-Free (RoHS)Pb-Free (RoHS)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Pb-Free (RoHS)Pb-Free (RoHS)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)

CU NIPDAUN / A for Pkg TypeCU NIPDAUN / A for Pkg TypeCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAUN / A for Pkg TypeCU NIPDAUN / A for Pkg TypeCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIM

The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

Addendum-Page 1

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PACKAGE OPTION ADDENDUM

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28-Aug-2010

OBSOLETE: TI has discontinued the production of the device.

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Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

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MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

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PACKAGEMATERIALSINFORMATION

www.ti.com

14-Jul-2012

TAPEANDREELINFORMATION

*Alldimensionsarenominal

Device

PackagePackagePinsTypeDrawingSOICSOIC

DWDW

2020

SPQ

ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0

24.424.4

10.810.8

B0(mm)13.013.0

K0(mm)2.72.7

P1(mm)12.012.0

WPin1(mm)Quadrant24.024.0

Q1Q1

CD74FCT244ATM96CD74FCT244M96

20002000

PackMaterials-Page1

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PACKAGEMATERIALSINFORMATION

www.ti.com

14-Jul-2012

*Alldimensionsarenominal

Device

CD74FCT244ATM96CD74FCT244M96

PackageType

SOICSOIC

PackageDrawing

DWDW

Pins2020

SPQ20002000

Length(mm)

367.0367.0

Width(mm)367.0367.0

Height(mm)

45.045.0

PackMaterials-Page2

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