专利名称：Film forming composition, insulating film,
and electronic device
发明人：Hidetoshi Hiraoka申请号：US11854821申请日：20070913公开号：US07569649B2公开日：20090804
摘要：A film forming composition includes a compound having a cage structure; and acompound having a conjugated diene structure.
申请人：Hidetoshi Hiraoka
地址：Shizuoka JP
国籍：JP
代理机构：Sughrue Mion, PLLC
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