专利名称：Method of forming encapsulated solid
electrochemical component
发明人：Hallmark, Christopher申请号：EP12165585.6申请日：20120425公开号：EP2518812A2公开日：20121031
专利附图：
摘要：A method of forming an encapsulated solid electrochemical componentincludes stacking a first separator (3), a solid electrochemical component (4), and asecond separator (5) on an upper surface of a vacuum plate to form an electrochemical
component assembly, applying a vacuum to the electrochemical component assembly,and applying a first laser beam around at least part of a circumference (21) of the solidelectrochemical component (4) in the electrochemical component assembly whileapplying the vacuum to melt and bond the first and second separators (3,5) together.The method also includes applying a second laser beam around the circumference (21) ofthe solid electrochemical component (4) in the electrochemical component assemblywhile applying the vacuum. The second laser beam has a second relatively high powercompared to the power of the first laser beam such that the first and second separators(3,5) around the circumference (21) of the solid electrochemical component (4) are cut.
申请人：EaglePicher Technologies, LLC
地址：C & Porter Streets Joplin, MO 64801 US
国籍：US
代理机构：Skone James, Robert Edmund
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