专利名称：ELECTRONIC COMPONENT BUILT-IN
BOARD, MANUFACTURING METHOD OFELECTRONIC COMPONENT BUILT-INBOARD, AND SEMICONDUCTOR DEVICE
发明人：Eiji TAKAIKE申请号：US12401721申请日：20090311
公开号：US20090229872A1公开日：20090917
专利附图：
摘要：An electronic component built-in board including an electronic component
having an electrode; a conductive material part arranged in an identical plane to theelectronic component; and a resin member configured to support the electronic
component and the conductive material part in a state where an upper side and a bottomside of the electronic component and an upper side and a bottom side of the conductivematerial part are exposed.
申请人：Eiji TAKAIKE
地址：Nagano-shi JP
国籍：JP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- haog.cn 版权所有 赣ICP备2024042798号-2
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务