Method for treating a substrate surface

专利名称：Method for treating a substrate surface发明人：Martin Stelzle,Pascal Doppelt申请号：US08/846107申请日：19970425公开号：US05939150A公开日：19990817

摘要：The present invention relates to a method for treating a substrate surface. Thesubstrate surface is coated with a thin film of a treating agent, which is capable ofenhancing or reducing its affinity towards a metal precursor by exposure to an arbitrarykind of radiation beam. In a subsequent metal deposition step utilizing the metalprecursor, the metal is selectively deposited on the exposed or unexposed areas,depending on the kind of treating agent. (FIG. 1)

申请人：MAX-PLANCK-GESELLSCHAFT ZUR FORDERUNG DER WISSENSCHAFTENE.V.,CNRS-SERVICE DE LA VALORISATION

代理机构：Ostrolenk, Faber, Gerb & Soffen, LLP

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