专利名称：Multilayer printed circuit board structure发明人：Joseph D. Leibowitz申请号：US06/564952申请日：19831222公开号：US04591659A公开日：19860527
摘要：A composite printed circuit board structure including multiple layers ofgraphite interleaved with layers of a dielectric material, such as a
polytetrafluoroethylene (PTFE) and woven glass laminate. Some of the dielectric layersare copper clad, and at least some of the graphite layers are positioned in close
proximity to the copper cladding layers, to provide good heat dissipation properties. ThePTFE provides a desirably low dielectric constant and the graphite also provides goodmechanical strength and a low or negative coefficient of thermal expansion, to permitmatching of the coefficient with that of chip carriers used to mount components on thecircuit board.
申请人：TRW INC.
代理人：James W. Paul,Donald R. Nyhagen,Noel F. Heal
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