Method of and apparatus for performing sequential

专利名称：Method of and apparatus for performing

sequential processes requiring differentamounts of time in the manufacturing ofsemiconductor devices

发明人：Jae-Hyuck An申请号：US11034950申请日：20050114

公开号：US20050136591A1公开日：20050623

专利附图：

摘要：A method of manufacturing a semiconductor device includes first and second

processes, the latter requiring more processing time. An apparatus for performing thesemiconductor manufacturing process includes a first reactor, and a plurality of secondreactors for each first reactor. A first group of wafers are subjected to the first processwithin the first reactor, and are then transferred into a second reactor as isolated fromthe outside air. The first group of wafers is subjected to the second process within thesecond reactor. At the same time, a second group of wafers are subjected to the firstprocess within the first reactor. After the first process is completed, the second group ofwafers is transferred into an unoccupied one of the second reactors as isolated from theoutside air. There, the second group of wafers is subjected to the second process.Accordingly, process failures otherwise due to the exposure of the wafers are minimized,and productivity is high despite the difference in the processing times.

申请人：Jae-Hyuck An

地址：Suwon-si KR

国籍：KR

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