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PCA9549资料

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PCA9549

Octal bus switch with individually I2C-bus controlled enables

Rev. 01 — 11 July 2006

Product data sheet

1.General description

The PCA9549 provides eight bits of high speed TTL-compatible bus switching controlledby the I2C-bus. The low ON-state resistance of the switch allows connections to be madewithminimalpropagationdelay.AnyindividualAtoBchannelorcombinationofchannelscanbeselectedviatheI2C-bus,determinedbythecontentsoftheprogrammableControlregister. When the I2C-bus bit is HIGH (logic1), the switch is on and data can ﬂow fromPortA to PortB, or viceversa. When the I2C-bus bit is LOW (logic0), the switch is open,creating a high-impedance state between the two ports, which stops the data ﬂow.An activeLOW reset input (RESET) allows the PCA9549 to recover from a situationwheretheI2C-busisstuckinaLOWstate.PullingtheRESETpinLOWresetstheI2C-busstate machine and causes all the bits to be open, as does the internal power-on resetfunction.

Three address pins allow up to eight devices on the same bus.

2.Features

IIIIIIIIIIIIIII

8-bit bus switch (CBT)

5Ω switch connection between two ports

I2C-bus interface logic; compatible with SMBus standardsActiveLOWRESET input3 address pins allowing up to 8 devices on the I2C-busBit selection via I2C-bus, in any combinationPower-up with all bits deselectedLow Ron switchesNo glitch on power-upSupports hot insertionLow standby current

Operating power supply voltage range of 2.3V to 5.5V5V tolerant inputs

0Hz to 400kHz clock frequency

ESD protection exceeds 2000V HBM per JESD22-A114, 200V MM perJESD22-A115 and 1000V CDM per JESD22-C101

ILatch-up testing is done to JEDEC Standard JESD78 which exceeds 100mAIPackages offered: SO24, TSSOP24, HVQFN24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

3.Ordering information

Table 1.

Ordering information

PackageNamePCA9549DPCA9549PWPCA9549BS

SO24TSSOP24HVQFN24

Descriptionplastic small outline package; 24 leads;bodywidth7.5mm

plastic thin shrink small outline package; 24 leads;bodywidth 4.4mm

plastic thermal enhanced very thin quad ﬂat package;no leads; 24terminals; body 4×4×0.85mm

VersionSOT137-1SOT355-1SOT616-1

Type number3.1Ordering options

Table 2.PCA9549DPCA9549PWPCA9549BS

Ordering options

Topside markPCA9549DPCA95499549

Temperature range−40°C to +85°C−40°C to +85°C−40°C to +85°C

Type number4.Block diagram

PCA95491A2A3A4A5A6A7A8A1B2B3B4B5B6B7B8BVSSVDDRESETSWITCH CONTROL LOGICRESETCIRCUITSCLSDAINPUTFILTERI2C-BUSCONTROLA0A1A2002aaa991Fig 1.Block diagramPCA9549_1

Product data sheetRev. 01 — 11 July 20062 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

5.Pinning information

5.1Pinning

A0A1RESET1A1B2A2B3A3B12345678924VDD23SDA22SCL21A2208A198B187A177B166A156B145A135B002aaa992A0A1RESET1A1B2A2B3A3B12345678924VDD23SDA22SCL21A2208A198B187A177B166A156B145A135B002aaa993PCA9549DPCA9549PW4A104B11VSS124A104B11VSS12Fig 2.Pin conﬁguration of SO2424RESETFig 3.Pin conﬁguration of TSSOP2420SDA23A11A1B2A2B3A3B1234565B105A116B1278922A0terminal 1index area19SCL18A2178A168B157A147B136A002aaa994PCA9549BSTransparent top viewFig 4.Pin conﬁguration of HVQFN24 (transparent top view)PCA9549_1

Product data sheetRev. 01 — 11 July 20063 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

5.2Pin description

Table 3.SymbolA0A1RESET1A1B2A2B3A3B4A4BVSS5B5A6B6A7B7A8B8AA2SCLSDAVDD

[1]

Pin descriptionPinSO, TSSOP123456789101112131415161718192021222324

HVQFN222324123456789[1]101112131415161718192021

address input 0address input 1activeLOW reset inputinputoutputinputoutputinputoutputinputoutputsupply groundoutputinputoutputinputoutputinputoutputinput

address input 2serial clock lineserial data linesupply voltageDescriptionHVQFNpackagediesupplygroundisconnectedtoboththeVSSpinandtheexposedcenterpad.TheVSSpinmustbeconnectedtosupplygroundforproperdeviceoperation.Forenhancedthermal,electrical,andboard-level performance, the exposed pad needs to be soldered to the board using a correspondingthermal pad on the board, and for proper heat conduction through the board thermal vias need to beincorporated in the PCB in the thermal pad region.

Product data sheetRev. 01 — 11 July 20064 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

6.Functional description

6.1Device addressing

Following a START condition, the bus master must output the address of the slave it isaccessing. The address of the PCA9549 is shown inFigure5. To conserve power, nointernal pull-up resistors are incorporated on the hardware selectable address pins andthey must be pulled HIGH or LOW.

1110A2A1A0R/Wfixedhardwareselectable002aaa962Fig 5.Slave addressThe last bit of the slave address deﬁnes the operation to be performed. When set tologic1 a read is selected, while a logic0 selects a write operation.

6.2Control register

Followingthesuccessfulacknowledgementoftheslaveaddress,thebusmasterwillsenda byte to the PCA9549, which will be stored in the Control register. If multiple bytes arereceived by the PCA9549, it will save the last byte received. This register can be writtenand read via the I2C-bus.

channel selection bits(read/write)7B76B65B54B43B32B21B10B0bit 1bit 2bit 3bit 4bit 5bit 6bit 7bit 8002aab254Fig 6.Control register6.2.1Control register deﬁnition

One or several bits are selected by the contents of the Control register. This register iswritten after the PCA9549 has been addressed. The entire control byte is used todetermine which bit is to be selected. When a bit is selected to close, the bit will closeafter the Acknowledge has been placed on the I2C-bus.

Product data sheetRev. 01 — 11 July 20065 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

Table 4.Control register

Write = channel selection; read = channel status.B7XXXXXXX01

[1]

B6XXXXXX01X

B5XXXXX01XX

B4XXXX01XXX

B3XXX01XXXX

B2XX01XXXXX

B1X01XXXXXX

B001XXXXXXX

Commandbit1 disabledbit1 enabledbit2 disabledbit2 enabledbit3 disabledbit3 enabledbit4 disabledbit4 enabledbit5 disabledbit5 enabledbit6 disabledbit6 enabledbit7 disabledbit7 enabledbit8 disabledbit8 enabled

Severalbitscanbeenabledatthesametime.Forexample,B7=0,B6=1,B5=0,B4=0,B3=1,B2=1,B1=0, B0=0, means that bit8, bit6, bit5, bit2, and bit1 are disabled and bit7, bit4, and bit3 areenabled.

6.3RESET inputTheRESET input is an activeLOW signal which may be used to recover from a bus faultcondition.ByassertingthissignalLOWforaminimumoftw(rst)L,thePCA9549willresetitsregisters and I2C-bus state machine and will open all bits. TheRESET input must beconnected to VDD through a pull-up resistor.

6.4Power-on reset

When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9549 inaresetstateuntilVDDhasreachedVPOR.Atthispoint,theresetconditionisreleasedandthePCA9549registersandI2C-busstatemachineareinitializedtotheirdefaultstates,allzeroes causing all the bits to be open (high-impedance state).

6.5CBT characteristic over VDD range

The bus switch is optimized at 5.0V but can operate over the entire supply range withlower Vo(sw) voltage and higher gate resistance.

Product data sheetRev. 01 — 11 July 20066 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

5.0Vo(sw)(V)4.0(1)(2)(3)002aaa9643.02.01.02.02.53.03.54.04.55.55.0VDD (V)(1)maximum(2)typical(3)minimumFig 7.Vo(sw) voltage versus VDDFigure7 shows the voltage characteristics of the pass gate transistors (note that thePCA9549 is only tested at the points speciﬁed inSection 9 “Static characteristics”). InorderforthePCA9549toactasavoltagetranslator,theVo(sw)voltageshouldbeequalto,orlowerthanthelowestbusvoltage.Forexample,ifthemainbuswasrunningat5V,andthedownstreambuseswere3.3Vand2.7V,thenVo(sw)shouldbeequaltoorbelow2.7Vto effectively clamp the downstream bus voltages. Looking atFigure7, we see that Vo(sw)(maximum) will be at 2.7V when the PCA9549 supply voltage is 3.5V or lower so thePCA9549supplyvoltagecouldbesetto3.3V.Pull-upresistorscanthenbeusedtobringthe bus voltages to their appropriate levels (seeFigure16).

Product data sheetRev. 01 — 11 July 20067 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

7.Characteristics of the I2C-bus

TheI2C-busisfor2-way,2-linecommunicationbetweendifferentICsormodules.Thetwolines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be

connected to a positive supply via a pull-up resistor. Data transfer may be initiated onlywhen the bus is not busy.

7.1Bit transfer

Onedatabitistransferredduringeachclockpulse.ThedataontheSDAlinemustremainstable during the HIGH period of the clock pulse as changes in the data line at this timewill be interpreted as control signals (seeFigure8).

SDASCLdata linestable;data validchangeof dataallowedmba607Fig 8.Bit transfer7.1.1START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW

transition of the data line while the clock is HIGH is deﬁned as the START condition (S).ALOW-to-HIGHtransitionofthedatalinewhiletheclockisHIGHisdeﬁnedastheSTOPcondition (P) (seeFigure9).

SDASDASCLSSTART conditionPSTOP conditionSCLmba608Fig 9.Deﬁnition of START and STOP conditions7.2System conﬁguration

A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. Thedevice that controls the message is the ‘master’ and the devices which are controlled bythe master are the ‘slaves’ (seeFigure10).

Product data sheetRev. 01 — 11 July 20068 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

SDASCLMASTERTRANSMITTER/RECEIVERSLAVERECEIVERSLAVETRANSMITTER/RECEIVERMASTERTRANSMITTERMASTERTRANSMITTER/RECEIVERI2C-BUSMULTIPLEXERSLAVE002aaa966Fig 10.System conﬁguration7.3Acknowledge

The number of data bytes transferred between the START and the STOP conditions fromtransmitter to receiver is not limited. Each byte of eightbits is followed by one

acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,whereas the master generates an extra acknowledge related clock pulse.

Aslavereceiverwhichisaddressedmustgenerateanacknowledgeafterthereceptionofeach byte. Also a master must generate an acknowledge after the reception of each bytethat has been clocked out of the slave transmitter. The device that acknowledges has topulldowntheSDAlineduringtheacknowledgeclockpulse,sothattheSDAlineisstableLOW during the HIGH period of the acknowledge related clock pulse; set-up and holdtimes must be taken into account.

A master receiver must signal an end of data to the transmitter by not generating anacknowledge on the last byte that has been clocked out of the slave. In this event, thetransmitter must leave the data line HIGH to enable the master to generate a STOPcondition.

data outputby transmitternot acknowledgedata outputby receiveracknowledgeSCL from masterSSTARTcondition128clock pulse foracknowledgement9002aaa987Fig 11.Acknowledgement on the I2C-busPCA9549_1© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheetRev. 01 — 11 July 20069 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

7.4Bus transactions

Data is transmitted to the PCA9549 control register using the Write mode as shown inFigure12.

slave addressSDAS1110A2A1A00AB7B6control registerB5B4B3B2B1B0APSTART conditionR/Wacknowledgefrom slaveacknowledgefrom slaveSTOP condition002aac430Fig 12.Write control registerData is read from the PCA9549 using the Read mode as shown inFigure13.

slave addressSDAS1110A2A1A01AB7B6control registerB5B4B3B2B1last byteB0APSTART conditionR/Wacknowledgefrom slaveno acknowledgefrom masterSTOP condition002aac431Fig 13.Read control register8.Limiting values

Table 5.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).[1]SymbolVDDVIIIIOIDDISSPtotTstgTamb

[1]

Parametersupply voltageinput voltageinput currentoutput currentsupply currentground supply currenttotal power dissipationstorage temperatureambient temperature

ConditionsMin−0.5−0.5−20−25−100−100-−60

Max+7.0+7.0+20+25+100+100400+150+85

UnitVVmAmAmAmAmW°C°C

operating−40

The performance capability of a high-performance integrated circuit in conjunction with its thermal

environment can create junction temperatures which are detrimental to reliability. The maximum junctiontemperature of this integrated circuit should not exceed 125°C.

Product data sheetRev. 01 — 11 July 200610 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

9.Static characteristics

Table 6.Static characteristics

VDD = 2.3V to 3.6V; VSS = 0V; Tamb =−40°C to +85°C; unless otherwise speciﬁed.SeeTable7 on page12 for VDD = 4.5V to 5.5V[1].SymbolSupplyVDDIDDIstbVPORVILVIHIOLILCiVILVIHILICi

Pass gateRon

ON-state resistance

VDD=3.0V to 3.6V; VO=0.4V;IO=15mA

VDD=2.3V to 2.7V; VO=0.4V;IO=10mA

Vo(sw)

switch output voltage

Vi(sw)=VDD=3.3V; Io(sw)=−100µAVi(sw)=VDD=3.0V to 3.6V;Io(sw)=−100µA

Vi(sw)=VDD=2.5V; Io(sw)=−100µAVi(sw)=VDD=2.3V to 2.7V;Io(sw)=−100µA

ILCio

[1][2]

Parametersupply voltagesupply currentstandby currentpower-on reset voltageLOW-level input voltageHIGH-level input voltageLOW-level output currentleakage currentinput capacitanceLOW-level input voltageHIGH-level input voltageinput leakage currentinput capacitance

ConditionsMin2.3

Typ-200.11.6-----6---2781.9-1.5--3

Max3.65012.1+0.3VDD6--+121+0.3VDDVDD+0.5+151215-2.8-2.0+15

UnitVµAµAVVVmAmAµApFVVµApFΩΩVVVVµApF

Operatingmode;VDD=3.6V;noload;VI=VDD or VSS; fSCL=100kHzStandby mode; VDD=3.6V; noload;VI=VDDorVSS

noload; VI=VDDorVSS

[2]

---−0.50.7VDD

Input SCL; input/output SDA

VOL=0.4VVOL=0.6VVI=VDDorVSSVI=VSS36−1-−0.50.7VDD

Select inputs A0toA2,RESETpin at VDD or VSSVI=VSS

−1----1.6-1.0−1-

leakage currentinput/output capacitance

VI=VDDorVSSVI=VSS

For operation between published voltage ranges, refer to the worst-case parameters in both ranges.VDD must be lowered to 0.2V in order to reset part.

Product data sheetRev. 01 — 11 July 200611 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

Table 7.Static characteristics

VDD = 4.5V to 5.5V; VSS = 0V; Tamb =−40°C to +85°C; unless otherwise speciﬁed.SeeTable6 on page11 for VDD = 2.3V to 3.6V[1].SymbolSupplyVDDIDD

supply voltagesupply current

Operating mode; VDD=5.5V;noload; VI=VDD or VSS;fSCL=100kHz

Standby mode; VDD=5.5V;noload; VI=VDDorVSSnoload; VI=VDDorVSS

[2]

ParameterConditionsMin4.5-

Typ-65

Max5.5100

UnitVµA

IstbVPORVILVIHIOLIILIIHCiVILVIHILICi

Pass gateRonVo(sw)

standby currentpower-on reset voltageLOW-level input voltageHIGH-level input voltageLOW-level output currentLOW-level input currentHIGH-level input currentinput capacitanceLOW-level input voltageHIGH-level input voltageinput leakage currentinput capacitanceON-state resistanceswitch output voltage

--−0.50.7VDD

0.61.7------6---253.6--3

22.1+0.3VDD6--1121+0.3VDDVDD+0.5+5058-4.5+105

µAVVVmAmAµAµApFVVµApFΩVVµApF

Input SCL; input/output SDA

VOL=0.4VVOL=0.6VVI=VSSVI=VSSVI=VSS3611-−0.50.7VDD

Select inputs A[0:2]/RESETpin at VDD or VSSVI=VSS

VDD=4.5V to 5.5V; VO=0.4V;IO=15mAVi(sw)=VDD=5.0V;Io(sw)=−100µA

Vi(sw)=VDD=4.5V to 5.5V;Io(sw)=−100µA

−1---2.6−10-

ILCio

[1][2]

leakage currentinput/output capacitance

VI=VDDorVSSVI=VSS

For operation between published voltage ranges, refer to the worst-case parameters in both ranges.VDD must be lowered to 0.2V in order to reset part.

Product data sheetRev. 01 — 11 July 200612 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

10.Dynamic characteristics

Table 8.SymbolDynamic characteristicsParameterConditionsStandard-modeI2C-busMintPDfSCLtBUFtHD;STAtLOWtHIGHtSU;STAtSU;STOtHD;DATtSU;DATtrtfCbtSPtVD;DATtVD;ACKRESETtw(rst)LtrsttREC;STA

[1][2][3][4]

Fast-mode I2C-busUnitMin-01.30.61.30.60.60.60[3]100

Max0.25[1]400------0.9-nskHzµsµsµsµsµsµsµsnsnsµsµsnsµsµsµsnsnsns

Max0.25[1]100------3.45-10003004005010.61---

propagation delaySCL clock frequency

bus free time between a STOP andSTART condition

hold time (repeated) START conditionLOW period of the SCL clockHIGH period of the SCL clockset-up time for a repeated STARTcondition

set-up time for STOP conditiondata hold timedata set-up time

rise time of both SDA and SCLsignals

fall time of both SDA and SCL signalscapacitive load for each bus linepulse width of spikes that must besuppressed by the input ﬁlterdata valid time

data valid acknowledge timeLOW-level reset timereset time

recovery time to START condition

A to B;

VDD=4.5Vto 5.5V

-04.7

[2]

4.04.74.04.74.00[3]250----

20+0.1Cb[4]30020+0.1Cb[4]300-----45000

4005010.61---

HIGH-to-LOWLOW-to-HIGH

---4

SDA clear5000

Pass gate propagation delay is calculated from the 6Ω typical Ron and the 50pF load capacitance.After this period, the ﬁrst clock pulse is generated.

A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order tobridge the undeﬁned region of the falling edge of SCL.Cb=total capacitance of one bus line in pF.

Product data sheetRev. 01 — 11 July 200613 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

SDAtBUFtLOWSCLtrtftHD;STAtSPtHD;STAPStHD;DATtHIGHtSU;DATtSU;STASrtSU;STOP002aaa986Fig 14.Deﬁnition of timing on the I2C-busSTARTSCLACK or read cycleSDA70 %trstRESET50 %trec(rst)50 %tw(rst)L002aac31450 %Fig 15.Deﬁnition ofRESET timingPCA9549_1© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheetRev. 01 — 11 July 200614 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

11.Application information

VDD = 5.0 VVDD = 5.0 VI2C-bus/SMBusMASTERSDASCLSDASCLRESET1A1Bbit 12A2Bbit 23A3Bbit 3PCA95494A4Bbit 45A5Bbit 56A6Bbit 67AA2A1A0VSS8A8B7Bbit 7bit 8002aaa995Remark:B can also be input and A can also be output as shown in bit8.Fig 16.Typical applicationABCDESCLSDARESETABCDE002aac279Fig 17.Custom multiplexer or demultiplexer applicationPCA9549_1

Product data sheetRev. 01 — 11 July 200615 of 24

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PCA9549

Octal bus switch with individually I2C-bus controlled enables

AAABACADBABBBCBDSCLSDARESETAB002aac280Fig 18.2 channel 4-to-1 multiplexer or demultiplexer12.Test information

2VDDVDDPULSEGENERATORRTRLVODUTCL50 pF002aac315CL=load capacitance includes jig and probe capacitanceRL=load resistanceRT=termination resistance; should be equal to Zo of pulse generatorFig 19.Test circuitPCA9549_1© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

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PCA9549

Octal bus switch with individually I2C-bus controlled enables

13.Package outline

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

DEAXcyHEvMAZ2413QA2pin 1 indexLpL1ebp12wMdetail XA1(A )3θA05scale10 mmDIMENSIONS (inch dimensions are derived from the original mm dimensions)UNITmminchesAmax.2.650.1A10.30.1A22.452.25A30.250.01bp0.490.36c0.320.23D(1)15.615.20.610.60E(1)7.67.40.300.29e1.270.05HE10.6510.00L1.4Lp1.10.4Q1.11.00.0430.039v0.250.01w0.250.01y0.10.004Z(1)θo0.90.40.0350.0160.0120.0960.0040.0890.0190.0130.0140.0090.4190.0430.0550.3940.0168o0Note1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINEVERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITAEUROPEANPROJECTIONISSUE DATE99-12-2703-02-19Fig 20.SO24 package outline (SOT137-1)

PCA9549_1

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mmSOT355-1

DEAXcyHEvMAZ2413QA2pin 1 indexA1(A )3AθLpLdetail X1ebp12wM02.5scale5 mmDIMENSIONS (mm are the original dimensions) UNITmmAmax.1.1A10.150.05A20.950.80A30.25bp0.300.19c0.20.1D(1)7.97.7E(2)4.54.3e0.65HE6.66.2L1Lp0.750.50Q0.40.3v0.2w0.13y0.1Z(1)0.50.2θ8o0oNotes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.OUTLINEVERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITAEUROPEANPROJECTIONISSUE DATE99-12-2703-02-19Fig 21.TSSOP24 package outline (SOT355-1)

PCA9549_1

Product data sheetRev. 01 — 11 July 200618 of 24

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;24 terminals; body 4 x 4 x 0.85 mm

SOT616-1

DBAterminal 1index areaAEA1cdetail Xe11/2 eCb1213evMCABwMCy1Cye7L6Eh1/2 ee21terminal 1index area1824Dh019X2.5scale5 mmDIMENSIONS (mm are the original dimensions)UNITmmA(1)max.1A10.050.00b0.300.18c0.2D(1)4.13.9Dh2.251.95E(1)4.13.9Eh2.251.95e0.5e12.5e22.5L0.50.3v0.1w0.05y0.05y10.1Note1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINEVERSION SOT616-1 REFERENCES IEC- - - JEDECMO-220 JEITA- - -EUROPEANPROJECTIONISSUE DATE01-08-0802-10-22Fig 22.HVQFN24 package outline (SOT616-1)

PCA9549_1

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Philips Semiconductors

PCA9549

Octal bus switch with individually I2C-bus controlled enables

14.Soldering

14.1Introduction to soldering surface mount packages

There is no soldering method that is ideal for all surface mount IC packages. Wave

solderingcanstillbeusedforcertainsurfacemountICs,butitisnotsuitableforﬁnepitchSMDs. In these situations reﬂow soldering is recommended.

14.2Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux andbinding agent) to be applied to the printed-circuit board by screen printing, stencilling orpressure-syringe dispensing before package placement. Driven by legislation andenvironmental forces the worldwide use of lead-free solder pastes is increasing.Several methods exist for reﬂowing; for example, convection or convection/infraredheating in a conveyor type oven. Throughput times (preheating, soldering and cooling)vary between 100secondsand200seconds depending on heating method.Typical reﬂow temperatures range from 215°Cto260°C depending on solder pastematerial. The peak top-surface temperature of the packages should be kept below:

Table 9.

SnPb eutectic process - package peak reﬂow temperatures (fromJ-STD-020CJuly 2004)

Volume mm3 <350240°C+0/−5°C225°C+0/−5°C

Volume mm3≥350225°C+0/−5°C225°C+0/−5°C

Package thickness< 2.5 mm≥2.5 mmTable 10.

Pb-free process - package peak reﬂow temperatures (fromJ-STD-020C July2004)

Volume mm3 <350260°C + 0°C260°C + 0°C250°C + 0°C

Volume mm3 350 to2000260°C + 0°C250°C + 0°C245°C + 0°C

Volume mm3 >2000260°C + 0°C245°C + 0°C245°C + 0°C

Package thickness< 1.6 mm1.6 mm to 2.5 mm≥ 2.5 mm

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3Wave soldering

Conventional single wave soldering is not recommended for surface mount devices(SMDs) or printed-circuit boards with a high component density, as solder bridging andnon-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcallydeveloped.

If wave soldering is used the following conditions must be observed for optimal results:

•Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

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–larger than or equal to 1.27mm, the footprint longitudinal axis ispreferred to beparallel to the transport direction of the printed-circuit board;–smaller than 1.27mm, the footprint longitudinal axismust be parallel to thetransport direction of the printed-circuit board.The footprint must incorporate solder thieves at the downstream end.

•For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporatesolder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet ofadhesive. The adhesive can be applied by screen printing, pin transfer or syringedispensing. The package can be soldered after the adhesive is cured.

Typicaldwelltimeoftheleadsinthewaverangesfrom3secondsto4secondsat250°Cor 265°C, depending on solder material applied, SnPb or Pb-free respectively.Amildly-activated ﬂux will eliminate the need for removal of corrosive residues in mostapplications.

14.4Manual soldering

Fixthecomponentbyﬁrstsolderingtwodiagonally-oppositeendleads.Usealowvoltage(24V or less) soldering iron applied to the ﬂat part of the lead. Contact time must belimited to 10seconds at up to 300°C.

When using a dedicated tool, all other leads can be soldered in one operation within2secondsto5seconds between 270°Cand320°C.

14.5Package related soldering information

Table 11.Package[1]BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,SSOP..T[3], TFBGA, VFBGA, XSON

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,HVSON, SMSPLCC[5], SO, SOJLQFP, QFP, TQFP

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L[8], PMFP[9], WQCCN..L[8]

[1][2]

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Soldering methodWavenot suitablenot suitable[4]

Reﬂow[2]suitablesuitable

suitable

not recommended[5][6]not recommended[7]not suitable

suitablesuitablesuitablenot suitable

For more detailed information on the BGA packages refer to the(LF)BGA Application Note (AN01026);order a copy from your Philips Semiconductors sales ofﬁce.

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, themaximum temperature (with respect to time) and body size of the package, there is a risk that internal orexternal package cracks may occur due to vaporization of the moisture in them (the so called popcorneffect). For details, refer to the Drypack information in theDataHandbook IC26; Integrated CircuitPackages; Section: Packing Methods.

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[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on noaccountbeprocessedthroughmorethanonesolderingcycleorsubjectedtoinfraredreﬂowsolderingwithpeaktemperatureexceeding217°C±10°Cmeasuredintheatmosphereofthereﬂowoven.Thepackagebody peak temperature must be kept as low as possible.

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, thesolder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsinkon the top side, the solder might be deposited on the heatsink surface.

If wave soldering is considered, then the package must be placed at a 45° angle to the solder wavedirection. Thepackage footprint must incorporate solder thieves downstream and at the side corners.Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8mm; it isdeﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm.

WavesolderingissuitableforSSOP,TSSOP,VSOandVSSOPpackageswithapitch(e)equaltoorlargerthan 0.65mm; itis deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm.Image sensor packages in principle should not be soldered. They are mounted in sockets or deliveredpre-mountedonﬂexfoil.However,theimagesensorpackagecanbemountedbytheclientonaﬂexfoilbyusing a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.Hot bar soldering or manual soldering is suitable for PMFP packages.

[4]

[5][6][7][8]

[9]

15.Abbreviations

Table 12.AcronymCBTCDMDUTESDHBMI2CMMPCBSMBusTTL

Abbreviations

DescriptionCross Bar TechnologyCharged Device ModelDevice Under TestElectroStatic DischargeHuman Body ModelInter Integrated CircuitMachine ModelPrinted-Circuit BoardSystem Management BusTransistor-Transistor Logic

16.Revision history

Table 13.

Revision history

Release date20060711

Data sheet statusProduct data sheet

Change notice-Supersedes-Document IDPCA9549_1

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17.Legal information

17.1Data sheet status

Document status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet

[1][2][3]

Product status[3]DevelopmentQualiﬁcationProduction

DeﬁnitionThis document contains data from the objective speciﬁcation for product development.This document contains data from the preliminary speciﬁcation.This document contains the product speciﬁcation.

Please consult the most recently issued document before initiating or completing a design.The term ‘short data sheet’ is explained in section “Deﬁnitions”.

Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatusinformation is available on the Internet at URLhttp://www.semiconductors.philips.com.

17.2Deﬁnitions

Draft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodiﬁcations or additions. Philips Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of

informationincludedhereinandshallhavenoliabilityfortheconsequencesofuse of such information.

Short data sheet —A short data sheet is an extract from a full data sheetwiththesameproducttypenumber(s)andtitle.Ashortdatasheetisintendedforquickreferenceonlyandshouldnotbereliedupontocontaindetailedandfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local Philips Semiconductorssalesofﬁce.Incaseofanyinconsistencyorconﬂictwiththeshortdatasheet,the full data sheet shall prevail.

to result in personal injury, death or severe property or environmental

damage. Philips Semiconductors accepts no liability for inclusion and/or useof Philips Semiconductors products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk.

Applications —Applications that are described herein for any of these

products are for illustrative purposes only. Philips Semiconductors makes norepresentation or warranty that such applications will be suitable for thespeciﬁed use without further testing or modiﬁcation.

Limiting values —Stress above one or more limiting values (as deﬁned intheAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanentdamage to the device. Limiting values are stress ratings only and and

operation of the device at these or any other conditions above those given inthe Characteristics sections of this document is not implied. Exposure tolimiting values for extended periods may affect device reliability.

Terms and conditions of sale —Philips Semiconductors products are soldsubjecttothegeneraltermsandconditionsofcommercialsale,aspublishedathttp://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitationof liability, unless explicitly otherwise agreed to in writing by Philips

Semiconductors.Incaseofanyinconsistencyorconﬂictbetweeninformationin this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant,conveyanceorimplicationofanylicenseunderanycopyrights,patentsor other industrial or intellectual property rights.

17.3Disclaimers

General —Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representationsor warranties, expressed or implied, as to the accuracy or completeness ofsuch information and shall have no liability for the consequences of use ofsuch information.

Right to make changes —Philips Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation speciﬁcations and product descriptions, at any time and withoutnotice.Thisdocumentsupersedesandreplacesallinformationsuppliedpriorto the publication hereof.

Suitability for use —Philips Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or

malfunctionofaPhilipsSemiconductorsproductcanreasonablybeexpected

17.4Trademarks

Notice:Allreferencedbrands,productnames,servicenamesandtrademarksare the property of their respective owners.

I2C-bus —logo is a trademark of Koninklijke Philips Electronics N.V.

18.Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

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19.Contents

1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Ordering information. . . . . . . . . . . . . . . . . . . . . 23.1Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 24Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 25Pinning information. . . . . . . . . . . . . . . . . . . . . . 35.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 46Functional description . . . . . . . . . . . . . . . . . . . 56.1Device addressing . . . . . . . . . . . . . . . . . . . . . . 56.2Control register. . . . . . . . . . . . . . . . . . . . . . . . . 56.2.1Control register deﬁnition . . . . . . . . . . . . . . . . . 56.3RESET input. . . . . . . . . . . . . . . . . . . . . . . . . . . 66.4Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 66.5CBT characteristic over VDD range. . . . . . . . . . 67Characteristics of the I2C-bus. . . . . . . . . . . . . . 87.1Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87.1.1START and STOP conditions . . . . . . . . . . . . . . 87.2System conﬁguration . . . . . . . . . . . . . . . . . . . . 87.3Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 97.4Bus transactions. . . . . . . . . . . . . . . . . . . . . . . 108Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 109Static characteristics. . . . . . . . . . . . . . . . . . . . 1110Dynamic characteristics . . . . . . . . . . . . . . . . . 1311Application information. . . . . . . . . . . . . . . . . . 1512Test information. . . . . . . . . . . . . . . . . . . . . . . . 1613Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1714Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2014.1Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2014.2Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 2014.3Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 2014.4Manual soldering . . . . . . . . . . . . . . . . . . . . . . 2114.5Package related soldering information . . . . . . 2115Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 2216Revision history. . . . . . . . . . . . . . . . . . . . . . . . 2217Legal information. . . . . . . . . . . . . . . . . . . . . . . 2317.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 2317.2Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2317.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 2317.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 2318Contact information. . . . . . . . . . . . . . . . . . . . . 2319

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com.

For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 11 July 2006Document identifier: PCA9549_1

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